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HANA Microelectronics Group.
Lead Frame : C7025 Cu lead frame, PPF is optional: Die Attach : Ablebond 84-1 LMISR4, Ablebond 843J. Ablebond 2200D for Green Package: Wire : 1.0, 1.25, 1.3, and 1.5 mils
Unisem
Epoxy - Ablebond 8290: Mold Compound - G600 : Lead Finish...
ICP Data - Maxim/Dallas
Die_Attach_Ablebond_2025-D_10-4-06.pdf (PDF, 172kB) Die_Attach_Ablebond_2200D.pdf (PDF, 881kB) Die_Attach_Ablebond_2033SC_9-6-06.pdf (PDF, 186kB) Die_Attach_Ablebond_3230_2-1-06.pdf...
Conductive Epoxy
Counts- 20. Material- Ablebond 8390P Needle- 30 Gauge.0008 Gap. Overall Average-.0091158 Overall % Error- 2.40912 @ 3 Sigma. Screw Type- Shallow Air Pressure-.25 Bars Velocity- 55 counts/ms
Miller Polymer Corporation - Products
Emerson Cuming ABLEBOND 84-1 LMINB 30 minutes @ 150'C 4320 Emerson Cuming ABLEBOND 84-1 LMIT-1 2 hours @ 125'C or 1 hour @ 150'C...
ICP 데이터 - Maxim/Dallas
Die_Attach_Ablebond_2025-D_10-4-06.pdf (PDF, 172kB) Die_Attach_Ablebond_2200D.pdf (PDF, 881kB) Die_Attach_Ablebond_2033SC_9-6-06.pdf (PDF, 186kB) Die_Attach_Ablebond_3230_2-1-06.pdf...
HANA Microelectronics Group.
Lead Frame : C194 Cu lead frame, PPF is optional: Die Attach : Ablebond 84-1 LMISR4, Ablebond 843J. Ablebond 2200D for Green Package: Wire : 1.0, 1.25, and 1.3 mils
Ablebond Resin Grades from Ablestik Laboratories
Ablebond resin grades from Ablestik Laboratories... Ablebond resin grades from Ablestik Laboratories.
